India’s expanding pool of trained talent is drawing in a lot of international semiconductor design businesses, according to Union Minister for Railways, Information & Broadcasting, and Electronics & IT Ashwini Vaishnaw on Tuesday.
The minister stated that one of the main objectives of the Semiconductor Mission has been to create a robust and deep talent pipeline, and that this endeavor is now yielding benefits while speaking at the opening of chip design behemoth ARM’s new office in Bengaluru.
Vaishnaw stated, “Building a very deep talent pipeline is one of the major targets we have taken under the semiconductor mission, and this is reflected in the way so many global design companies are coming to India because the talent is here.”
The minister emphasized that 278 universities and other institutions nationwide are receiving funding from the Semiconductor Mission, giving students access to the newest EDA tools available for chip design.
Students have already created 28 chips to date. This illustrates the trust that multinational semiconductor firms have in India,” he continued.
Additionally, Vaishnaw declared that ARM’s new Bengaluru facility will design cutting-edge processors, including two-nanometer (2nm) devices.
He commended ARM and its group for selecting India as a location for such innovative work.
The minister pointed out that ecosystem partners are also establishing facilities in India, including providers of chemicals, gasses, substrates, and production equipment.
With a large number of design-linked incentive (DLI) startups gaining money from venture capital partners, design capabilities are expanding quickly at the same time.
Vaishnaw said that in order to foster innovation in the fields of biotechnology, semiconductors, artificial intelligence, and other cutting-edge technology, the government has established the India Deep Tech Fund, which will start with $1 billion.
In addition to design and fabrication, the minister stated that the next Version 2.0 of the Semiconductor Mission will concentrate on creating the tools and materials needed for chip manufacture.
“We are working on the entire semiconductor stack, including chip design, production, talent pipeline development, and the construction of the necessary tools and materials. “This is just the beginning, and the progress is excellent,” he remarked.
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